Comparison of Er,Cr:YSGG and Diode Lasers In Second Stage Implant Surgery

Study Results

Results pending

The study team has not published outcome measurements, participant flow, or safety data for this trial yet. Check back later for updates.

Basic Information

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Recruitment Status

COMPLETED

Clinical Phase

NA

Total Enrollment

40 participants

Study Classification

INTERVENTIONAL

Study Start Date

2017-11-27

Study Completion Date

2018-08-20

Brief Summary

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The study evaluates postoperative pain, intraoperative bleeding and wound healing after second stage implant surgery. Submerged implants were exposed with diode laser in Group 1 (n=20) and by using Er,Cr:YSGG laser in Group 2 (n=20).

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Detailed Description

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Conditions

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Postoperative Pain Soft Tissue Bleeding Wound Heal

Study Design

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Allocation Method

RANDOMIZED

Intervention Model

PARALLEL

Primary Study Purpose

TREATMENT

Blinding Strategy

DOUBLE

Participants Investigators

Study Groups

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Diode laser

Soft tissue incision with 940 nm Gallium Aluminum Arsenide diode laser, at implant recovery settings (2.5 W output power, average power: 1.25 W, pulse length : 1.00 ms, pulse interval: 1.00 ms) in second-stage implant surgery.

Group Type EXPERIMENTAL

940 nm Gallium Aluminum Arsenide Diode Laser

Intervention Type DEVICE

Exposure of the cover screw of osseointegrated dental implants embedded under oral mucosa by performing the soft tissue incision with diode laser for placing the healing abutment.

Erbium laser

Soft tissue incision with 2780 nm Er,Cr:YSGG laser, at implant recovery settings (2.00 W power, 100 Hz, H mode, 10% water and 10% air) in second-stage implant surgery.

Group Type EXPERIMENTAL

2780 nm Er,Cr:YSGG Laser

Intervention Type DEVICE

Exposure of the cover screw of osseointegrated dental implants embedded under oral mucosa by performing the soft tissue incision with erbium laser for placing the healing abutment.

Interventions

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940 nm Gallium Aluminum Arsenide Diode Laser

Exposure of the cover screw of osseointegrated dental implants embedded under oral mucosa by performing the soft tissue incision with diode laser for placing the healing abutment.

Intervention Type DEVICE

2780 nm Er,Cr:YSGG Laser

Exposure of the cover screw of osseointegrated dental implants embedded under oral mucosa by performing the soft tissue incision with erbium laser for placing the healing abutment.

Intervention Type DEVICE

Eligibility Criteria

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Inclusion Criteria

* subject has osseointegrated implants embedded under oral mucosa.
* subject undergoes second-stage implant surgery.

Exclusion Criteria

* inadequate keratinized gingiva in the implant site.
* localization of the implant site is not possible due to excessive thickness of the oral mucosa

Minimum Eligible Age

18 Years

Maximum Eligible Age

70 Years

Eligible Sex

ALL

Accepts Healthy Volunteers

Yes